Dear customers

In order to guarantee the quality of your products and ensure the timely delivery of products, please read the following incoming material standards carefully.

Specification of electronic components incoming standard

1. For bulk orders (more than 50 sets of orders), the incoming materials of resistor, capacitor and diodes should be packed in a tray; for proofing orders, the length of short cutting strip should be more than 30cm and no crease is allowed.

2. IC, BGA and other chips must be properly packed (tape and tray), and the packaging should be standardized, the materials should be placed in order, and the direction should be consistent, so as to avoid the damage or deformation of materials in the process of transportation; do not use adhesive tape to stick on the material body, so as to avoid static damage to the material or residual glue sticking on the body, which will cause material damage in the process of equipment reclaiming.

3. For humidity sensitive devices, vacuum moisture-proof packaging should be carried out to avoid material oxidation.

4. Different materials should not be mixed in one package.

5. All patch materials should not be in bulk.

6. The package of each kind of material should have the material number, specification, quantity and other relevant information, so as to accurately identify the material.

7. All incoming materials shall be provided with packing list and electronic file list.

8. During the mounting process, small components (including 8pin and below small IC) are easy to be thrown and difficult to find in the equipment. Please provide the allowable loss of the order to ensure the timely delivery of the product.

1. The comparison between plate loading and short cutting less than 30cm

The material belt of proofing order should be at least 30cm long and intact without damage and crease. The ideal condition is to pack in a tray with P / N of material, valid period of production and clear material information.

If the tape is shorter than 30cm, it can not be put on the machine, and there is a quality risk in the hand stick.

2. Comparison between short cut material greater than 30cm and bulk material

Machine pasting is fast, high efficiency and good quality; hand pasting has quality risk and low efficiency.

3. Hazards of regular and bulk packing of dip incoming materials

The serial port of non chip connector should be equipped with proper tray device to prevent quality problems such as deformation in the process of inserting and welding.

If dip is sent in bulk, it will cause quality problems such as material pin deformation, device damage and false soldering.

4. Chip packaging

Correct chip packaging: cover the IC and BGA with the right size tray to prevent the IC and BGA from deforming and breaking during transportation.

Wrong chip packaging: improper packaging will lead to chip function damage, pin deformation, residual adhesive tape may cause material and machine damage.

Warm reminder:

1. To provide the allowable loss (including 8pin and below small IC) is to avoid the inevitable throwing of the equipment in the mounting process, resulting in the empty placement, which is to be repaired by you, or to delay the delivery of the product when you repair the material for the second time;

2. The correct packaging of incoming materials will avoid the damage of materials in the process of back and forth transportation; ensure the quality and safety of materials. Such incoming materials will make the SMT warehouse quickly complete the preparation of materials, and the quality of standardized materials will be greatly improved after the placement, so as to avoid subsequent maintenance, shorten the production cycle, and strive for the best time for your delivery;

3. Standardized incoming materials will speed up our "fast, efficient and punctual" completion of your products and strive for the maximum benefits for you.

——Thank you for your cooperation